It is suitable for components such as IC chips, integrated blocks and dual in-line insertion, which can quickly separate components from the circuit. The material is heat treated to ensure elasticity and not easy to deform. 1.The DIP can be easily removed from the substrate without damaging any IC conductors. PLCC, PGA, PCLL, DIP packaged ICs can be pulled out from SOCKET or PCB. 2.Use the handshake method to pull up the IC smoothly in the vertical direction (not forcibly pull up), so that the pulled out IC can obtain a complete PIN 3.For densely arranged ICs, it can be directly pulled out without touching other ICs 4.ICs of different sizes within 55mm of the contact surface can be pulled out in a very short time, the operation is simple and labor-saving. 1.The DIP can be easily removed from the substrate without damaging any IC conductors. PLCC, PGA, PCLL, DIP packaged ICs can be pulled out from SOCKET or PCB. 2.Use the handshake method to pull up the IC smoothly in the vertical direction (not forcibly pull up), so that the pulled out IC can obtain a complete PIN 3.For densely arranged ICs, it can be directly pulled out without touching other ICs 4.ICs of different sizes within 55mm of the contact surface can be pulled out in a very short time, the operation is simple and labor-saving. Combination of stainless steel and pvc Stainless steel covered with pvc Feel comfortable Insulation safety Simple and beautiful Double hook design, smooth and convenient Not easily deformed easy grip Does not hurt the equipment Provides Anti-Static small hook easy extracting IC installation